Oerlikon Systems

System Features 

• Configurable platform to operate as high volume 300mm tool with split or bridge tool capability for 200mm wafers
  
• Modular design for flexibility of process configuration and superior process control
• Mini environment with 300mm FOUP load ports or open cassettes for 200mm
• Integration platform with eight ports for two cassette stations and up to six process modules
• Open and modular system architecture is easily configurable and expandable
  
• Applications include all current PVD metallization steps, including pre- and post-treatment modules such as degas and ICP soft etch

Atmospheric Front End

• Load Port Modules
  • 300mm FOUP load ports or open cassettes for 200mm
• Mini Environment
  • Wafer Aligner Vacuum wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05 mm).
  • Scara Robots three axes or four axes
  • Wafer flip for 300mm back side metallization platform

Platform

• handling platform delivers highest wafer yield and easy operation.
  
• Two FOUP load-port cassette stations, featuring ergonomic loading, mapping functions to detect cross-slotted, double-loaded wafers, with instant wafer slide out (protrusion) detection at cassette stations
  
• Two Airlocks with dual shelve and integrated cooling
  
• Magnetically driven robot system with dual bi-symmetric arms
  
• Production-proven wafer handling and processing capability for wafer thickness down to 300 µm and waferbow up to 2 mm; carrier solution for thinner wafers

CLUSTERLINE® 300 II  Integration platform with process modules	CLUSTERLINE® 300 II  Atmospheric Front-End

Process Modules

• Degassing module
  • Chuck heater for up to 300°C
• ICP soft etch module
  • SiO₂ removal rate, 0.6 – 0.8 nm/sec
• PVD process module
  • Metal chuck with mechanical wafer clamping
  • ESC or clampless chuck with shadow mask
  • Clamped chuck configuration with gas conduction back side heater/cooler for precise temperature control
  • ARQ 310 DC or pulsed sputter source with uniformity compensation over target life
  • RF-Bias

Control System

• Advanced cluster tool control system with ControlWorks® software
• User friendly GUI with standard PC running Windows
• Real time process flow, sequence and step editors, choice of sequential and parallel wafer routing as well as carrier scheduling functions
• Closed ballroom compatible racks, remote location up to 100 m
• Fab integration with SEMI SECS/GEM interface

Layout