Market Segments
Oerlikon Systems develops innovative production equipment for:
Deposition and etch processes used in the semiconductor device fabrication industry.
Advanced Packaging, including UBM for Pb, Pb-free and Au bumps, redistribution, and integrated passives Thin Wafer and Multi-Level Metallization, including backside metallization on ultra-thin wafers, CMOS and BiCMOS
Compound Semi, MEMS and Nanotechnology, including RF micro components, high brightness solid state lighting, thin film magnetic heads and other nonsilicon based applications
Metallizers - to sputter films on all discs
Advanced Nano Technologies - Solutions for clean energy production - such as:
Photovoltaic
Touch Panels
Thermoelectrics
Energy Storage
Oerlikon Systems