Oerlikon Systems


About Systems

Historical Milestones

2009July
Wafer Processing awarded VLSI 10 best ranking #3 for 10th consecutive year.
2008Mai
Wafer Processing awarded VLSI 10 best ranking #3 for nine consecutive year.
2007June
Wafer Processing awarded VLSI 10 best ranking for eight consecutive year.
2006April
Wafer processing unveils MASK ETCHER V, the fifth generation plasma Photomask etch system enabling 45nm Photomask etching and beyond.
2006
Hard Disk Solution: RACETRACK
Line Solution: INDIGO for BD ROM & INDIGO R/RE for BD R/RE
2005
Multilayer Sputtering Solution: SPRINTER-5 for BD R inorganic media & SPRINTER 750 13ch for MiniDisc
Line Solution: MATRIX for HD-DVD ROM & FUSION for DVD R DL
2005
Flagship Clusterline 200 II latest generation high performance 200mm cluster tool introduced to the market.
2004
Multilayer Sputtering Solution: DVD SPRINTER Ultraspeed 1440 Discs / hour
Sputtering Solution: CUBE STAR 4000 Discs / hour
Line Solution: OFFLINE BONDER for DVD R SL and DL
2004
100th Photomask Plasma Etch System delivered.
Versaline modular plasma process platform introduced to the market.
Evaporation products divested to Evatech.
2003
Sputtering Solution: SWIVEL 2003 2600 Discs / hour & CUBE LITE 2003
Line Solution: MATRIX for DVD ROM & FUSION for DVD-R
2003
100th CLUSTERLINE System delivered.
2002
Line Solution: PARAGON for DVD+RW
2002
Unaxis introduced the Clusterline 300 for sputtering of 12” wafer size to the market.
2001
Multilayer Sputtering Solution: SPRINTER 750 13ch
Sputtering Solution: CUBE LITE 2000 & SWIVEL 2000 2400 Discs/h
Hard Disk Solution: CIRCULUS MX & CIRCULUS MX14 II
2001
Starline tool is introduced to the market as a one of a kind back-side metal deposition tool.
2000
Multilayer Sputtering Solution: DVD Sprinter 1000 Discs / hour
Sputtering Solution: PYRAMET Master Metallizer & CDM PLUS Master Metallizer
Hard Disk Solution: CIRCULUS M14
2000
Plasma-Therm merges with Balzers BPS and becomes Unaxis group.
1999
Multilayer Sputtering Solution: Multi SPRINTER 1500 & SPRINTER 750
1998
Sputtering Solution: TWISTER 2 1450 Discs / hour & COMET & SWIVEL98 2200 Discs / hour
Hard Disk Solution: CIRCULUS M14
1997
Multilayer Solution BIG SPRINTER 500
Sputtering Solution: TWISTER 1200 Discs / hour & CUBE LITE
1997
Unaxis introduces the Clusterline 200 to the market, which is their 3rd gen. multi-chamber PVD cluster tool for up to 200 mm wafers.
1996
Multilayer Solution: SPRINTER 500
Hard Disk Solution: CIRCULUS M12
1995
Multi Layer Solution: SDS 131
Sputtering Solution: CUBE
1995
Flagship Versalock multi-chamber platform for production wafer processing created.
1994
Sputtering Solution: CDI 915 1800 Discs / hour
1994
First ever Photomask plasma etch system introduced to the market. Balzers introduces the LLS 502, the third generation batch sputter system
1993
Multilayer Solution: SDS 100
Sputtering Solution: CDI 901 1000 Discs / hour
Hard Disk Solution: CIRCULUS M8
1993
Merger between Balzers/Liechtenstein and Leybold group in Germany completed.
1991
Plasma-Therm Inc. relocates production facility to Florida
1988
Balzers introduces the LLS 900, the second generation batch sputter system
1987
Balzers launches their 1st gen. innovative high through-put PVD cluster tool called Clusterline 9000.
1986
First production 200mm plasma etch equipment introduced to the market by Plasma- Therm.
1985
Industry first single wafer production plasma etch reactor by Plasma- Therm.
1983
Balzers introduces the SWS the first single wafer sputtering system worldwide.
1979
Balzers introduces the LLS 801 a batch sputter system to the market
1978
Plasma Therm shipped first RF based plasma process equipment.
1976
Plasma-Therm Inc. founded as RF generator and analytical equipment company
  • Print page