Historical Milestones

- 2009July
Wafer Processing awarded VLSI 10 best ranking #3 for 10th consecutive year.
- 2008Mai
Wafer Processing awarded VLSI 10 best ranking #3 for nine consecutive year.
- 2007June
Wafer Processing awarded VLSI 10 best ranking for eight consecutive year.
- 2006April
Wafer processing unveils MASK ETCHER V, the fifth generation plasma Photomask etch system enabling 45nm Photomask etching and beyond.
- 2006
Hard Disk Solution: RACETRACK
Line Solution: INDIGO for BD ROM & INDIGO R/RE for BD R/RE
- 2005
Multilayer Sputtering Solution: SPRINTER-5 for BD R inorganic media & SPRINTER 750 13ch for MiniDisc
Line Solution: MATRIX for HD-DVD ROM & FUSION for DVD R DL
- 2005
Flagship Clusterline 200 II latest generation high performance 200mm cluster tool introduced to the market.
- 2004
Multilayer Sputtering Solution: DVD SPRINTER Ultraspeed 1440 Discs / hour
Sputtering Solution: CUBE STAR 4000 Discs / hour
Line Solution: OFFLINE BONDER for DVD R SL and DL
- 2004
100th Photomask Plasma Etch System delivered.
Versaline modular plasma process platform introduced to the market.
Evaporation products divested to Evatech.
- 2003
Sputtering Solution: SWIVEL 2003 2600 Discs / hour & CUBE LITE 2003
Line Solution: MATRIX for DVD ROM & FUSION for DVD-R
- 2003
100th CLUSTERLINE System delivered.
- 2002
Line Solution: PARAGON for DVD+RW
- 2002
Unaxis introduced the Clusterline 300 for sputtering of 12” wafer size to the market.
- 2001
Multilayer Sputtering Solution: SPRINTER 750 13ch
Sputtering Solution: CUBE LITE 2000 &
SWIVEL 2000 2400 Discs/h
Hard Disk Solution: CIRCULUS MX & CIRCULUS MX14 II
- 2001
Starline tool is introduced to the market as a one of a kind back-side metal deposition tool.
- 2000
Multilayer Sputtering Solution: DVD Sprinter 1000 Discs / hour
Sputtering Solution: PYRAMET Master Metallizer & CDM PLUS Master Metallizer
Hard Disk Solution: CIRCULUS M14
- 2000
Plasma-Therm merges with Balzers BPS and becomes Unaxis group.
- 1999
Multilayer Sputtering Solution: Multi SPRINTER 1500 & SPRINTER 750
- 1998
Sputtering Solution: TWISTER 2 1450 Discs / hour &
COMET &
SWIVEL98 2200 Discs / hour
Hard Disk Solution: CIRCULUS M14
- 1997
Multilayer Solution BIG SPRINTER 500
Sputtering Solution: TWISTER 1200 Discs / hour &
CUBE LITE
- 1997
Unaxis introduces the Clusterline 200 to the market, which is their 3rd gen. multi-chamber PVD cluster tool for up to 200 mm wafers.
- 1996
Multilayer Solution: SPRINTER 500
Hard Disk Solution: CIRCULUS M12
- 1995
Multi Layer Solution: SDS 131
Sputtering Solution: CUBE
- 1995
Flagship Versalock multi-chamber platform for production wafer processing created.
- 1994
Sputtering Solution: CDI 915 1800 Discs / hour
- 1994
First ever Photomask plasma etch system introduced to the market.
Balzers introduces the LLS 502, the third generation batch sputter system
- 1993
Multilayer Solution: SDS 100
Sputtering Solution: CDI 901 1000 Discs / hour
Hard Disk Solution: CIRCULUS M8
- 1993
Merger between Balzers/Liechtenstein and Leybold group in Germany completed.
- 1991
Plasma-Therm Inc. relocates production facility to Florida
- 1988
Balzers introduces the LLS 900, the second generation batch sputter system
- 1987
Balzers launches their 1st gen. innovative high through-put PVD cluster tool called Clusterline 9000.
- 1986
First production 200mm plasma etch equipment introduced to the market by Plasma- Therm.
- 1985
Industry first single wafer production plasma etch reactor by Plasma- Therm.
- 1983
Balzers introduces the SWS the first single wafer sputtering system worldwide.
- 1979
Balzers introduces the LLS 801 a batch sputter system to the market
- 1978
Plasma Therm shipped first RF based plasma process equipment.
- 1976
Plasma-Therm Inc. founded as RF generator and analytical equipment company