Oerlikon Systems

Applications

Advanced Packaging
Backside Metallization and Thin Wafer Processing
Compound Semi, MEMS & Nanotechnology
- CLUSTERLINE 200 II
- LLS EVO II
IC Interconnects
Above IC Image Sensors on CMOS
Nano Technologies
Contact

Compound Semi, MEMS & Nanotechnology

Compound Semi, MEMS & Nanotechnology applications are increasingly used in the Telecommunications Industry. Production solutions use metallization and PECVD processes.

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