Oerlikon Systems

Oerlikon Systems serves the market including the segments: Advanced Packaging (UBM for Pb, Pb-free and Au bumps, redistribution, and integrated passives), Thin Wafer and Multi-Level Metallization (backside metallization on ultra-thin wafers, CMOS and BICMOS), and Compound Semi, MEMS & Nanotechnology (RF micro components and technologies for optoelectronics and other non-silicon based applications). Process technologies include PVD, PECVD and etching.

 In the data storage industry we further develop and serve CD formats, DVD / HD-DVD formats, Blu-ray / HD formats solutions. Thin film deposition - sputtering for reflective, semi reflective and information layers for ROM, R, RE as well as backside protection.